MC9S12DT128CPVE Datasheet, PDF (91/128 Pages) Freescale Semiconductor, Inc – Device User Guide

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calculations refer to Section A.1.8 Power Dissipation and Thermal
Characteristics.
Table A-4 Operating Conditions
Rating
Symbol
Min
Typ
Max Unit
I/O, Regulator and Analog Supply Voltage
V_DD5
4.5
5
5.25
V
Digital Logic Supply Voltage ¹
V_DD
2.35
2.5
2.75
V
PLL Supply Voltage ²
V_DDPLL
2.25
2.5
2.75
V
Voltage Difference VDDX to VDDR and VDDA
∆_VDDX
-0.1
0
0.1
V
Voltage Difference VSSX to VSSR and VSSA
∆_VSSX
-0.1
0
0.1
V
Oscillator
f_osc
0.5
-
16
MHz
Bus Frequency
f_bus
0.5
-
25
MHz
MC9S12DT128BC
Operating Junction Temperature Range
T_J
-40
-
100
°C
Operating Ambient Temperature Range ²
T_A
-40
27
85
°C
MC9S12DT128BV
Operating Junction Temperature Range
T
J
-40
-
120
°C
Operating Ambient Temperature Range ²
T_A
-40
27
105
°C
MC9S12DT128BM
Operating Junction Temperature Range
T_J
-40
-
140
°C
Operating Ambient Temperature Range ²
T_A
-40
27
125
°C
NOTES:
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The
absolute maximum ratings apply when this regulator is disabled and the device is powered from an external
source.
2. Please refer to Section A.1.8 Power Dissipation and Thermal Characteristics for more details about the rela-
tion between ambient temperature T_A and device junction temperature T_J.
A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T_J) in °C can be
obtained from:
TJ = TA + (PD • Θ_JA)
TJ = Junction Temperature, [°C ]
TA = Ambient Temperature, [°C ]
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