MC33912_10 Datasheet, PDF (8/94 Pages) Freescale Semiconductor, Inc – LIN System Basis Chip with DC Motor Pre-driver and Current Sense

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
MC33912G5AC / MC34912G5AC
Table 3. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ESD Capability
V
AECQ100
Human Body Model - JESD22/A114 (C_ZAP = 100 pF, R_ZAP = 1500 Ω)
LIN Pin
V_ESD1-1
± 8.0k
L1, L2, L3, and L4
V_ESD1-2
± 6.0k
all other Pins
Charge Device Model - JESD22/C101 (C_ZAP = 4.0 pF)
V_ESD1-3
±2000
Corner Pins (Pins 1, 8, 9, 16, 17, 24, 25 and 32)
All other Pins (Pins 2-7, 10-15, 18-23, 26-31)
According to LIN Conformance Test Specification / LIN EMC Test
Specification, August 2004 (C_ZAP = 150 pF, R_ZAP = 330 Ω)
V_ESD2-1
V_ESD2-2
± 750
± 500
Contact Discharge, Unpowered
LIN pin with 220 pF
V_ESD3-1
± 20k
LIN pin without capacitor
V_ESD3-2
± 11k
VS1/VS2 (100 nF to ground)
Lx inputs (33 kΩ serial resistor)
According to IEC 61000-4-2 (C_ZAP = 150 pF, R_ZAP = 330 Ω)
V_ESD3-3
V_ESD3-4
>± 12k
±6000
Unpowered
LIN pin with 220 pF and without capacitor
VS1/VS2 (100 nF to ground)
Lx inputs (33 kΩ serial resistor)
V_ESD4-1
V_ESD4-2
V_ESD4-3
± 8000
± 8000
± 8000
THERMAL RATINGS
Operating Ambient Temperature ⁽⁸⁾
T_A
33912
34912
°C
-40 to 125
-40 to 85
Operating Junction Temperature
Storage Temperature
Thermal Resistance, Junction to Ambient
Natural Convection, Single Layer board (1s)^{(8), (9)}
Natural Convection, Four Layer board (2s2p)^{(8), (10)}
Thermal Resistance, Junction to Case⁽¹¹⁾
Peak Package Reflow Temperature During Reflow^{(12), (13)}
T_J
T_STG
R_θJA
R_θJC
T_PPRT
-40 to 150
-55 to 150
85
56
23
Note 13
°C
°C
°C/W
°C/W
°C
Notes
8. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
9. Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
10. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
11. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
12. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
13. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and
enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
33912
8
Analog Integrated Circuit Device Data
Freescale Semiconductor