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MC68L300 Datasheet, PDF (4/32 Pages) Freescale Semiconductor, Inc – 16.78 MHz Electrical Characteristics
Freescale Semiconductor, Inc.
Table 3 MC68L332 Typical Ratings
Num
1 Supply Voltage
Rating
2 Operating Temperature
VDD Supply Current
3
RUN
LPSTOP, External clock, max fsys
4 Clock Synthesizer Operating Voltage
5
VDDSYN Supply Current
External Clock, maximum fsys
RAM Standby Current
6
Normal RAM operation
Standby operation
7 Power Dissipation
Symbol
VDD
TA
IDD
VDDSYN
IDDSYN
ISB
PD
Value
3.3
25
45
1.0
3.3
2.0
3.0
10
148.0
Unit
V
°C
mA
mA
V
mA
µA
µA
mW
Table 4 Thermal Characteristics
Num
Rating
Symbol
Value
Unit
Thermal Resistance
1
Plastic 132-Pin Surface Mount
Plastic 144-Pin Surface Mount
ΘJA
38
49
°C/W
The average chip-junction temperature (TJ) in C can be obtained from:
TJ = TA + (PD × ΘJA) (1)
where:
TA = Ambient Temperature, °C
ΘJA= Package Thermal Resistance, Junction-to-Ambient, °C/W
PD = PINT + PI/O
PINT= IDD × VDD, Watts — Chip Internal Power
PI/O= Power Dissipation on Input and Output Pins — User Determined
For most applications PI/O < PINT and can be neglected. An approximate relationship between PD and TJ (if PI/O is
neglected) is:
PD = K ÷ (TJ + 273°C) (2)
Solving equations 1 and 2 for K gives:
K = PD + (TA + 273°C) + ΘJA × PD2 (3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring PD (at
equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations (1)
and (2) iteratively for any value of TA.
4
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MC68L300EC16/D