K20P144M100SF2 Datasheet, PDF (29/67 Pages) Freescale Semiconductor, Inc – K20 Sub-Family Data Sheet

Peripheral operating requirements and behaviors
6.3.3.2 32kHz Oscillator Frequency Specifications
Table 16. 32kHz oscillator frequency specifications (V_DD33OSC = V_DD33OSC (min)
to V_DD33OSC (max), T_A = T_L to T_H)
Symbol
f_{osc_lo}
t_start
Description
Oscillator crystal
Crystal start-up time
Min.
—
—
Typ.
32
1000
Max.
—
—
Unit
Notes
kHz
ms
1, 2
1. This parameter is characterized before qualification rather than 100% tested.
2. Proper PC board layout procedures must be followed to achieve specifications.
y ^{6.4 Memories and memory interfaces}
ar ^{6.4.1 Flash (FTFL) Electrical Characteristics}
in ^{This section describes the electrical characteristics of the FTFL module.}
6.4.1.1 Flash Timing Parameters — Program and Erase
The following characteristics represent the amount of time the internal charge pumps are
lim ^{active and do not include command overhead.}
Table 17. NVM program/erase timing characteristics
Symbol
e _thvpgm4
r _thversscr
P ^thversblk
Description
Longword Program high-voltage time
Sector Erase high-voltage time
Erase Block high-voltage time
Min.
Typ.
Max.
Unit
—
20
TBD
μs
—
20
100
ms
—
160
800
ms
Notes
1
1
1. Maximum time based on expectations at cycling end-of-life.
6.4.1.2 Flash Timing Parameters — Commands
Table 18. Flash command timing characteristics
Symbol
t_rd1blk
t_rd1sec2k
t_pgmchk
Description
Read 1s Block execution time
Read 1s Section execution time (2 KB flash sec‐
tor)
Program Check execution time
Min.
—
—
—
Typ.
—
—
—
Max.
1.4
40
35
Unit
ms
μs
μs
Table continues on the next page...
Notes
K20 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
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