K20P144M100SF2 Datasheet, PDF (20/67 Pages) Freescale Semiconductor, Inc – K20 Sub-Family Data Sheet

Peripheral operating requirements and behaviors
5.3.1 Thermal operating requirements
Table 9. Thermal operating requirements
Symbol
T_J
T_A
Description
Die junction temperature
Ambient temperature
Min.
Max.
Unit
–40
125
°C
–40
105
°C
5.3.2 Thermal attributes
Board
type
Single-
layer (1s)
Four-layer
(2s2p)
Single-
layer (1s)
Symbol
R_θJA
R_θJA
R_θJMA
Description
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (200 ft./
min. air speed)
y ₁₄₄
LQFP
r ₅₂
144 Unit
MAPBGA
50
°C/W
a ₄₄
30
°C/W
in⁴³
41
°C/W
Notes
1
1
1
Four-layer R_θJMA
Thermal resistance, junction to ambient (200 ft./ 38
27
°C/W
(2s2p)
min. air speed)
—
R_θJB
Thermal resistance, junction to board
33
17
°C/W
lim ^—
R_θJC
Thermal resistance, junction to case
11
10
°C/W
—
Ψ_JT
Thermal characterization parameter, junction to 2
2
°C/W
6 Peripheral oper_Pating^rre^equirements and behaviors ^{package top outside center (natural convection)}
1
2
3
4
6.1 Core modules
1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
2. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions
—Junction-to-Board.
3. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material between
the top of the package and the cold plate.
4. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
K20 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
20
Preliminary
Freescale Semiconductor, Inc.