K50P121M100SF2 Datasheet, PDF (20/69 Pages) Freescale Semiconductor, Inc – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz

Peripheral operating requirements and behaviors
4. 15pF load
5.3 Thermal specifications
5.3.1 Thermal operating requirements
Table 9. Thermal operating requirements
Symbol
T_J
T_A
Description
Die junction temperature
Ambient temperature
Min.
Max.
Unit
–40
125
°C
–40
85
°C
5.3.2 Thermal attributes
Board Symbol
type
Single-layer R_θJA
(1s)
Four-layer R_θJA
(2s2p)
Single-layer R_θJMA
(1s)
Four-layer R_θJMA
(2s2p)
—
R_θJB
—
R_θJC
—
Ψ_JT
Description
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (200 ft./min.
air speed)
Thermal resistance, junction to ambient (200 ft./min.
air speed)
Thermal resistance, junction to board
Thermal resistance, junction to case
Thermal characterization parameter, junction to
package top outside center (natural convection)
121 Unit
MAPBGA
TBD
°C/W
TBD
°C/W
TBD
°C/W
TBD
°C/W
TBD
TBD
TBD
°C/W
°C/W
°C/W
Notes
1
1
1
1
2
3
4
1.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
6 Peripheral operating requirements and behaviors
All digital I/O switching characteristics assume:
1. output pins
• have C_L=30pF loads,
• are configured for fast slew rate (PORTx_PCRn[SRE]=0), and
• are configured for high drive strength (PORTx_PCRn[DSE]=1)
K50 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
20
Preliminary
Freescale Semiconductor, Inc.