MC68HC705C8ACFNE Datasheet, PDF (173/222 Pages) Freescale Semiconductor, Inc – Freescale Semiconductor, Inc.

Freescale Semiconductor, Inc.
Electrical Specifications
Operating Temperature Range
13.4 Operating Temperature Range
Rating⁽¹⁾
Operating temperature range⁽²⁾
MC68HC705C8ACB
MC68HC705C8ACFB
MC68HC705C8ACFS
MC68HC705C8ACP
MC68HC705C8ACFN
MC68HC705C8ACFS
Symbol
T_A
1. Voltages referenced to V_SS
2. C = Extended temperature range (– 40°C to + 85°C)
P = Plastic dual in-line package (PDIP)
B = Plastic shrink dual in-line package (SDIP)
S = Ceramic dual in-line package (cerdip)
FN = Plastic-leaded chip carrier (PLCC)
FB = Quad flat pack (QFP)
FS = Ceramic-leaded chip carrier (CLCC)
Value
Unit
T_L to T_H
°C
– 40 to + 85
13.5 Thermal Characteristics
Characteristic
Thermal resistance
Plastic dual in-line package (DIP)
Ceramic dual in-line package (cerdip)
Plastic leaded chip carrier (PLCC)
Quad flat pack (QFP)
Plastic shrink DIP (SDIP)
Symbol
θ_JA
Value
60
50
70
95
60
Unit
°C/W
TEST
POINT
V_DD
R2
(SEE TABLE)
C
(SEE TABLE)
R1
(SEE TABLE)
V_DD = 4.5 V
Pins
PA7–PA0
PB7–PB0
PC7–PC0
PD4–PD1
R1
R2
C
3.26 kΩ 2.38 kΩ 50 pF
V_DD = 3.0 V
Pins
PA7–PA0
PB7–PB0
PC7–PC0
PD4–PD1
PD7, PD5, PD0
R1
10.91 kΩ
6 kΩ
R2
6.32 kΩ
6 kΩ
C
50 pF
200 pF
Figure 13-1. Equivalent Test Load
MC68HC705C8A — Rev. 3
MOTOROLA
Electrical Specifications
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Technical Data