FAN54300 Datasheet, PDF (7/43 Pages) Fairchild Semiconductor – USB-Compliant, Dual-Power Input, Single-Cell, Li-Ion Switching Charger with USB-OTG Boost Regulator

Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above
the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended
exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings
are stress ratings only.
Symbol
Parameter
VBUS
VIN
VBOOTU
VBOOTV
VPMID1
VSW1
VPMID2
VSW2
VO
dV_BUS
dt
VBUS Voltage
VIN Voltage
BOOTU Voltage
BOOTV Voltage
PMID1 Voltage
SW1 Voltage
PMID2 Voltage
SW2 Voltage
Other Pins
Continuous
Pulsed, 100 ms Maximum Non-Repetitive
Maximum Rate of VBUS Increase Above 5.5 V when IC Enabled
dV_IN
dt
Maximum Rate of VIN Increase Above 9.5 V when IC Enabled
ESD
Electrostatic Discharge
Protection Level
Human Body Model per JESD22-A114
Charged Device Model per JESD22-C101
TJ
Junction Temperature
TSTG Storage Temperature
TL
Lead Soldering Temperature, 10 Seconds
Note:
1. Lesser of 6.5 V or VREF + 0.3 V.
Min.
–1.4
–2.0
–2.0
-0.7
-0.7
–1.0
–0.7
–1.0
–0.7
–0.3
Max.
20.0
20.0
20.0
20.0
20.0
6.5
20.0
12.0
6.5⁽¹⁾
4
4
2.0
1.5
–40
+150
–65
+150
+260
Unit
V
V
V
V
V
V
V
V
V
V/s
V/s
kV
kV
°C
°C
°C
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding
them or designing to absolute maximum ratings.
Symbol
VBUS
VIN
TA
TJ
VBUS Supply Voltage
VIN Supply Voltage
Ambient Temperature
Junction Temperature
Parameter
Min.
4
4.0
–30
0
Max.
6
9.5
+85
+125
Units
V
V
°C
°C
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer 2s2p
boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature TJ(max) at a
given ambient temperate TA.
Symbol
Parameter
JA Junction-to-Ambient Thermal Resistance
JB Junction-to-PCB Thermal Resistance
Typical
60
20
Unit
°C/W
°C/W
© 2010 Fairchild Semiconductor Corporation
FAN54300 • Rev. 1.0.4
7
www.fairchildsemi.com