LM3S808 Datasheet, PDF (396/416 Pages) List of Unclassifed Manufacturers – Microcontroller

Package Information
7. Dambar removal protrusion does not exceed 0.08. Intrusion does not exceed 0.03.
8. Burr does not exceed 0.08 in any direction.
9. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall not cause
the lead width to exceed the maximum b dimension by more than 0.08. Dambar cannot be
located on the lower radius or the foot. Minimum space between protrusion and adjacent lead
is 0.07 for 0.40 and 0.50 pitch package.
10. Corner radius of plastic body does not exceed 0.20.
11. These dimensions apply to the flat section of the lead between 0.10 and 0.25 from the lead tip.
12. A1 is defined as the distance from the seating plane to the lowest point of the package body.
13. Finish of leads is tin plated.
14. All specifications and dimensions are subjected to IPAC’S manufacturing process flow and
materials.
15. M5-026A. Where discrepancies between the JEDEC and IPAC documents exist, this drawing
will take the precedence.
Symbol
Package Type
Note
48LD LQFP
MIN
NOM MAX
A
===
===
1.60
A₁
0.05
===
0.15
A₂
1.35
1.40
1.45
D
9.00 BSC
D₁
7.00 BSC
E
9.00 BSC
E₁
7.00 BSC
L
0.45
0.80
0.75
e
0.50 BSC
b
0.17
0.22
0.27
b1
0.17
0.20
0.23
c
0.09
===
0.20
c1
0.09
===
0.16
Tolerances of form and position
aaa
0.20
bbb
0.20
ccc
0.08
ddd
0.08
396
October 01, 2007
Preliminary