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CY7C1302CV25 Datasheet, PDF (13/18 Pages) Cypress Semiconductor – 9-Mbit Burst of Two Pipelined SRAMs with QDR™ Architecture
TAP Controller Block Diagram
PREMILINARY
CY7C1302CV25
0
TDI
Selection
Circuitry
Bypass Register
210
Instruction Register
Selection
Circuitry
TDO
31 30 29 . . 2 1 0
Identification Register
106 . . . . 2 1 0
Boundary Scan Register
TCK
TMS
TAP Controller
TAP Electrical Characteristics Over the Operating Range [11, 9, 25]
Parameter
VOH1
VOH2
VOL1
VOL2
VIH
VIL
IX
Description
Output HIGH Voltage
Output HIGH Voltage
Output LOW Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage
Input and Output Load Current
Test Conditions
IOH = −2.0 mA
IOH = −100 µA
IOL = 2.0 mA
IOL = 100 µA
GND ≤ VI ≤ VDDQ
Min.
1.7
2.1
1.7
–0.3
–5
Max.
Unit
V
V
0.7
V
0.2
V
VDD + 0.3
V
0.7
V
5
µA
TAP AC Switching Characteristics Over the Operating Range [26, 27]
Parameter
Description
Min.
Max.
tTCYC
tTF
tTH
tTL
Set-up Times
TCK Clock Cycle Time
TCK Clock Frequency
TCK Clock HIGH
TCK Clock LOW
100
10
40
40
tTMSS
TMS Set-up to TCK Clock Rise
10
tTDIS
TDI Set-up to TCK Clock Rise
10
tCS
Capture Set-up to TCK Rise
10
Hold Times
tTMSH
TMS Hold after TCK Clock Rise
10
tTDIH
TDI Hold after Clock Rise
10
tCH
Capture Hold after Clock Rise
10
Notes:
25. These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the Electrical Characteristics table.
26. TCS and TCH refer to the set-up and hold time requirements of latching data from the boundary scan register.
27. Test conditions are specified using the load in TAP AC test conditions. Tr/Tf = 1 ns.
Unit
ns
MHz
ns
ns
ns
ns
ns
ns
ns
ns
Document #: 38-05491 Rev. *A
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