EP7309_05 Datasheet, PDF (38/51 Pages) Cirrus Logic – High-performance, Low-power, System-on-chip with Enhanced Digital Audio Interface

EP7309
High-Performance, Low-Power System on Chip
256-Ball PBGA Package Characteristics
256-Ball PBGA Package Specifications
Pin 1 Corner
17.00 (0.669)
±0.20 (.008)
15.00 (0.590)
D1 ^{±0.20 (.008)}
17.00 (0.669)
±0.20 (.008)
E1
15.00 (0.590)
±0.20 (.008)
Pin 1 Indicator
30° TYP
0.85 (0.034)
±0.05 (.002)
0.40 (0.016)
±0.05 (.002)
TOP VIEW
2 Layer
0.36 (0.014)
±0.09 (0.004)
SIDE VIEW
1.00 (0.040)
REF
1.00 (0.040)
REF
1.00 (0.040)
D
17.00 (0.669)
1.00 (0.040)
E
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Pin 1 Corner
17.00 (0.669)
0.50
R
3 Places
BOTTOM VIEW
JEDEC #: MO-151
Ball Diameter: 0.50 mm ± 0.10 mm
17 ¥ 17 ¥ 1.61 mm body
Figure 14. 256-Ball PBGA Package
Note: 1) For pin locations see Table 21.
2) Dimensions are in millimeters (inches), and controlling dimension is millimeter
3) Before beginning any new EP7309 design, contact Cirrus Logic for the latest package information.
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(All Rights Reserved)
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