EP7309_05 Datasheet, PDF (29/51 Pages) Cirrus Logic – High-performance, Low-power, System-on-chip with Enhanced Digital Audio Interface

204-Ball TFBGA Package Characteristics
204-Ball TFBGA Package Specifications
TOP VIEW
A1 CORNER
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
C
SEATING PLANE
EP7309
High-Performance, Low-Power System on Chip
Ø0.08 M
C
Ø0.15 M C A
B
Ø0.25~0.35(204X)
BOTTOM VIEW
A1 CORNER
20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
A
B
12.35
13±0.05
0.65
0.15(4X) C
Ball Pitch :
Ball Diameter :
0.65
0.3
Substrate Thickness :
0.36
Mold Thickness
:
0.53
Figure 13. 204-Ball TFBGA Package
DS507F1
©Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
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