English
Language : 

EP7309_05 Datasheet, PDF (24/51 Pages) Cirrus Logic – High-performance, Low-power, System-on-chip with Enhanced Digital Audio Interface
EP7309
High-Performance, Low-Power System on Chip
Packages
208-Pin LQFP Package Characteristics
208-Pin LQFP Package Specifications
29.60 (1.165)
30.40 (1.197)
27.80 (1.094)
28.20 (1.110)
0.17 (0.007)
0.27 (0.011)
29.60 (1.165)
30.40 (1.197)
0.50
(0.0197)
BSC
Pin 208
Pin 1
EP7309
208-Pin LQFP
Pin 1 Indicator
27.80 (1.094)
28.20 (1.110)
0.45 (0.018)
0.75 (0.030)
1.35 (0.053)
1.45 (0.057)
1.00 (0.039) BSC
0.09 (0.004)
0.20 (0.008)
1.40 (0.055)
1.60 (0.063)
0.05 (0.002)
0.15 (0.006)
0° MIN
7° MAX
Figure 11. 208-Pin LQFP Package Outline Drawing
Note:
1) Dimensions are in millimeters (inches), and controlling dimension is millimeter.
2) Drawing above does not reflect exact package pin count.
3) Before beginning any new design with this device, please contact Cirrus Logic for the latest package information.
4) For pin locations, please see Figure 12. For pin descriptions see the EP7309 User’s Manual.
24
©Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
DS507F1