AT24C01D_14 Datasheet, PDF (20/26 Pages) ATMEL Corporation – IC-Compatible (2-wire) Serial EEPROM

12.2 8X — 8-lead TSSOP
C
1
Pin 1 indicator
this corner
E1
E
L1
N
Top View
A
b
A1
e
A2
D
Notes:
Side View
1. This drawing is for general information only. Refer to JEDEC
Drawing MO-153, Variation AA, for proper dimensions,
tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15mm (0.006in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
(0.010in) per side.
4. Dimension b does not include Dambar protrusion. Allowable
Dambar protrusion shall be 0.08mm total in excess of the b
dimension at maximum material condition. Dambar cannot be
located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07mm.
5. Dimension D and E1 to be determined at Datum Plane H.
H
L
End View
SYMBOL
A
A1
A2
D
E
E1
b
e
L
L1
C
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
-
0.05
0.80
2.90
4.30
0.19
0.45
0.09
NOM
-
-
1.00
3.00
6.40 BSC
4.40
–
0.65 BSC
0.60
1.00 REF
-
MAX
1.20
0.15
1.05
3.10
4.50
0.30
0.75
0.20
NOTE
2, 5
3, 5
4
Package Drawing Contact:
[e-mail]
TITLE
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
GPC
12/8/11
DRAWING NO. REV.
TNR
8X
E
20 AT24C01D and AT24C02D [DATASHEET]
Atmel-8871B-SEEPROM-AT24C01D-02D-Datasheet_032014