AT24C01D_14 Datasheet, PDF (17/26 Pages) ATMEL Corporation – IC-Compatible (2-wire) Serial EEPROM

10. Ordering Information
Atmel Ordering Code
AT24C01D-SSHM-T⁽¹⁾
AT24C01D-SSHM-B⁽²⁾
AT24C01D-XHM-T⁽¹⁾
AT24C01D-XHM-B⁽²⁾
AT24C01D-MAHM-T⁽¹⁾
AT24C01D-PUM
AT24C01D-STUM-T⁽¹⁾
AT24C01D-CUM-T⁽¹⁾
AT24C01D-WWU11M⁽³⁾
Lead Finish
NiPdAu
(Lead-free/Halogen-free)
Matte Tin
(Lead-free/Halogen-free)
SnAgCu Ball
(Lead-free/Halogen-free)
N/A
Package
8S1
8X
8MA2
8P3
5TS1
8U3-1
Wafer Sale
AT24C02D-SSHM-T⁽¹⁾
AT24C02D-SSHM-B⁽²⁾
AT24C02D-XHM-T⁽¹⁾
AT24C02D-XHM-B⁽²⁾
AT24C02D-MAHM-T⁽¹⁾
NiPdAu
(Lead-free/Halogen-free)
8S1
8X
8MA2
AT24C02D-PUM
AT24C02D-STUM-T⁽¹⁾
Matte Tin
(Lead-free/Halogen-free)
8P3
5TS1
AT24C02D-CUM-T⁽¹⁾
AT24C02D-WWU11M⁽³⁾
SnAgCu Ball
(Lead-free/Halogen-free)
N/A
8U3-1
Wafer Sale
Notes: 1. T = Tape and reel:
 SOIC = 4K units per reel
 TSSOP, UDFN, and SOT23 = 5K units per reel
2. B = Bulk
 SOIC and TSSOP = 100 units per tube
 PDIP = 50 units per tube
3. For wafer sales, please contact Atmel Sales.
Voltage
1.7V to 3.6V
1.7V to 3.6V
Operation Range
Industrial Temperature
(–40C to 85C)
Industrial Temperature
(–40C to 85C)
8S1
8X
8MA2
8P3
5TS1
8U3-1
Package Type
8-lead, 0.15” wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.40mm body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-pad, 2.00mm x 3.00mm body, 0.50mm Pitch, Ultra Thin Dual Flat No Lead (UDFN)
8-lead, 0.30” wide, Plastic Dual Inline Package (PDIP)
5-lead, 2.90mm x 1.60mm body, Plastic Thin Shrink Small Outline (SOT23)
8-ball, 1.50mm x 2.00mm body, 0.5mm pitch, Very thin Fine Ball Grid Array (VFBGA)
AT24C01D and AT24C02D [DATASHEET] 17
Atmel-8871B-SEEPROM-AT24C01D-02D-Datasheet_032014