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MT46V32M16CV-5B Datasheet, PDF (16/93 Pages) Alliance Semiconductor Corporation – Double Data Rate (DDR) SDRAM
512Mb: x4, x8, x16 DDR SDRAM
Electrical Specifications – IDD
Table 7:
IDD Specifications and Conditions (x16) Die Revision F Only
VDDQ = 2.6V ±0.1V, VDD = 2.6V ±0.1V (-5B); VDDQ = 2.5V ±0.2V, VDD = 2.5V ±0.2V (-6, -6T, -75E, -75Z, -75);
0°C d TA d 70°C; Notes: 1–5, 11, 13, 15, 47; Notes appear on pages 37–42; See also Table 10 on page 20
Parameter/Condition
Operating one-bank active-precharge current:
tRC = tRC (MIN); tCK = tCK (MIN); DQ, DM, and DQS inputs
changing once per clock cycle; Address and control inputs
changing once every two clock cycles
Operating one-bank active-read-precharge current:
Burst = 4; tRC = tRC (MIN); tCK = tCK (MIN); IOUT = 0mA;
Address and control inputs changing once per clock cycle
Precharge power-down standby current: All banks idle;
Power-down mode; tCK = tCK (MIN); CKE = (LOW)
Idle standby current: CS# = HIGH; All banks are idle;
tCK = tCK (MIN); CKE = HIGH; Address and other control
inputs changing once per clock cycle; VIN = VREF for DQ, DQS,
and DM
Active power-down standby current: One bank active;
Power-down mode; tCK = tCK (MIN); CKE = LOW
Active standby current: CS# = HIGH; CKE = HIGH; One bank
active; tRC = tRAS (MAX); tCK = tCK (MIN); DQ, DM, and DQS
inputs changing twice per clock cycle; Address and other
control inputs changing once per clock cycle
Operating burst read current: Burst = 2; Continuous
burst reads; One bank active; Address and control inputs
changing once per clock cycle; tCK = tCK (MIN); IOUT = 0mA
Operating burst write current: Burst = 2; Continuous burst
writes; One bank active; Address and control inputs changing
once per clock cycle; tCK = tCK (MIN); DQ, DM, and DQS inputs
changing twice per clock cycle
Auto refresh burst current:
tRFC = tRFC (MIN)
tRFC = 7.8µs
tRFC = 1.95µs
Self refresh current: CKE d 0.2V
Standard
Low power (L)
Operating bank interleave read current: Four bank
interleaving READs (burst = 4) with auto precharge,
tRC = minimum tRC allowed; tCK = tCK (MIN); Address and
control inputs change only during active READ or WRITE
commands
Symbol -5B -6/6T -75E -75Z/-75
IDD0 155 130 130 115
IDD1 195 160 160 145
IDD2P
5
5
5
5
IDD2F 55 45 45
40
IDD3P 45 35 35
30
IDD3N 60 50 50
45
IDD4R 210 165 165 145
IDD4W 215 195 160 135
IDD5 345 290 290 280
IDD5A 11 10 10
10
IDD5A 16 15 15
15
IDD6
65
5
5
IDD6A
4
3
3
3
IDD7 480 405 400 350
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
Notes
23, 48
23, 48
24, 33
51
24, 33
23
23, 48
23
50
28, 50
28, 50
12
12
23, 49
PDF: 09005aef80a1d9d4/Source: 09005aef82a95a3a
512Mb_DDR_x4x8x16_D2.fm - 512Mb DDR: Rev. Q; Core DDR Rev. E 7/11 EN
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