EX128-TQG100A Datasheet, PDF (20/44 Pages) Actel Corporation – eX Automotive Family FPGAs

eX Automotive Family FPGAs
Package Thermal Characteristics
The device junction-to-case thermal characteristic is θ_jc,
and the junction-to-ambient air characteristic is θ_ja. The
thermal characteristics for θ_ja are shown with two
different air flow rates. θ_jc is provided for reference.
The maximum junction temperature is 150°C.
The maximum power dissipation allowed for eX devices
is a function of θ_ja. A sample calculation of the absolute
maximum power dissipation allowed for a TQFP 100-pin
package at automotive temperature and still air is as
follows:
Maximum Power Allowed
=
M------a---x---.---j-u---n---c---t--i-o---n-----t-e---m-----p---.----(---°_--C----)----–_{----M------a--x---.---a---m-----b---i-e---n---t---t--e---m----p---.---(---}°_--C-----)
θ_ja(°C/W)
=
1---5---0-3---°_{3---C.--5---°}–_{---C--1--/-2W---5---}°_---C--
=
0.746 W
Table 1-12 • Package Thermal Characteristics
Package Type
Thin Quad Flat Pack
Thin Quad Flat Pack
Chip-Scale Package
Chip-Scale Package
Chip-Scale Package
Pin Count
θ_jc
64
12.0
100
14.0
49
128
180
Still Air
42.4
33.5
72.2
54.1
57.8
θ_ja
θ_ja 1.0 m/s
36.3
27.4
59.5
44.6
47.6
θ_ja 2.5 m/s
34.0
25.0
54.1
40.6
43.3
Units
°C/W
°C/W
°C/W
°C/W
°C/W
1-16
v3.2