XQ18V04 Datasheet, PDF (16/17 Pages) Xilinx, Inc – QPro XQ18V04 (XQR18V04) QML In-System Programmable Configuration PROMs

QPro XQ18V04 (XQR18V04) QML In-System Programmable Configuration PROMs
R
Ordering Information
Device Number
Package Type
XQ18V04 CC44 V
Device Ordering Options
Device Type
XQ18V04
XQR18V04⁽¹⁾
CC44
VQ44
Package
44-pin Ceramic Chip Carrier Package
44-pin Plastic Thin Quad Flat Package
Notes:
1. Radiation Hardened.
Grade (Manufacturing Flow /
Temperature Range)
Grade
M Military Ceramic T_C = –55°C to +125°C
N Military Plastic
V QPro-Plus
T_J = –55°C to +125°C
T_C = –55°C to +125°C
Generic Standard
Microcircuit Drawing (SMD)
Radiation Hardened⁽¹⁾
Device Type
5962 - 01525 Q Y A
Lead Finish
Package Type
QML Certified MIL-PRF-38535
SMD Ordering Options
Device Type
QML
Package
5962-01525 XQ18V04
-
44-pin Ceramic Chip Carrier Package
5962R01525 XQR18V04
-
44-pin Plastic Thin Quad Flat Package
Notes:
1. Type R designates Radiation Hardened.
Valid Ordering Combinations
Mil-Std
XQ18V04CC44M
XQ18V04VQ44N
SMD
-
-
Rad Hard
XQR18V04CC44M
XQR18V04CC44V
Lead Finish
Solder Dip
Solder Plate
SMD
-
16
www.xilinx.com
DS082 (v1.2) November 5, 2001
1-800-255-7778
Preliminary Product Specification