W25Q32FV Datasheet, PDF (96/99 Pages) Winbond – 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

11. ORDERING INFORMATION
W25Q32FV
W = Winbond
W⁽¹⁾ 25Q 32F V xx⁽²⁾ I
25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
32F = 32M-bit
V = 2.7V to 3.6V
SS = 8-pin SOIC 208-mil ST = 8-pin VSOP 208-mil SF = 16-pin SOIC 300-mil
DA = 8-pin PDIP 300-mil ZP = WSON8 6x5-mm
ZE = WSON8 8x6-mm
TB = TFBGA 8x6-mm (5x5-1 ball array)
TC = TFBGA 8x6-mm (6x4 ball array)
I = Industrial (-40°C to +85°C)
(3,4)
G=
F=
P=
Q=
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
Green Package with Fast Sector Erase time (tSE)
Green Package with Status Register Power-Down & OTP enabled
Green Package with QE=1 in Status Register-2
Notes:
1.The “W” prefix is not included on the part marking.
2.Only the 2^nd letter is used for the part marking; WSON package type ZP & ZE are not used for the part marking.
3.Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel (shape T) or
Tray (shape S), when placing orders.
4.For shipments with OTP feature enabled, please specify when placing orders.
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