W25Q32FV Datasheet, PDF (5/99 Pages) Winbond – 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

W25Q32FV
10.5 16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 91
10.6 8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 92
10.7 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array).......................................... 93
10.8 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array)............................................. 94
11. ORDERING INFORMATION .......................................................................................................... 95
11.1 Valid Part Numbers and Top Side Marking ........................................................................ 96
12. REVISION HISTORY...................................................................................................................... 97
Publication Release Date: Sept 16,, 2013
-4-
Revision H