W25Q32FV Datasheet, PDF (91/99 Pages) Winbond – 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

10.4 8-Pad WSON 8x6-mm (Package Code ZE)
W25Q32FV
Symbol
A
A1
b
C
D
D2
E
E2
e
L
y
Min
0.70
0.00
0.35
---
7.90
3.35
5.90
4.25
---
0.45
0.00
Millimeters
Nom
0.75
0.02
0.40
0.20 REF
8.00
3.40
6.00
4.30
1.27
0.50
---
Max
0.80
0.05
0.48
---
8.10
3.45
6.10
4.35
---
0.55
0.050
Min
0.028
0.000
0.014
---
0.311
0.132
0.232
0.167
---
0.018
0.000
Inches
Nom
0.030
0.001
0.016
0.008 REF
0.315
0.134
0.236
0.169
0.050
0.020
---
Max
0.031
0.002
0.019
---
0.319
0.136
0.240
0.171
---
0.022
0.002
Note:
1.The metal pad area on the bottom center of the package is not connected to any internal electrical signals. It can be left floating or
connected to the device ground (GND pin). Avoid placement of exposed PCB vias under the pad.
- 90 -
Publication Release Date: Sept 16,, 2013
Revision H