W25Q32FWZPIG-TR Datasheet, PDF (93/94 Pages) Winbond – 1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

W25Q32FW
10.12 Valid Part Numbers and Top Side Marking
The following table provides the valid part numbers for the W25Q32FW SpiFlash Memory. Please contact
Winbond for specific availability by density and package type. Winbond SpiFlash memories use a 12-digit
Product Number for ordering. However, due to limited space, the Top Side Marking on all packages uses
an abbreviated 10-digit number.
PACKAGE TYPE
SS
SOIC-8 208-mil
ST
VSOP-8 208-mil
SF
SOIC-16 300-mil
ZP
WSON-8 6x5-mm
XG
XSON-8
4x4x0.45-mm
ZE
WSON-8 8x6-mm
TB
TFBGA-24 8x6-mm
(5x5 Ball Array)
TC
TFBGA-24 8x6-mm
(6x4 Ball Array)
BY⁽²⁾
12-ball WLCSP
BY⁽²⁾
12-ball WLCSP
DENSITY
32M-bit
32M-bit
32M-bit
32M-bit
32M-bit
32M-bit
32M-bit
32M-bit
32M-bit
32M-bit
PRODUCT NUMBER
W25Q32FWSSIG
W25Q32FWSSIQ
W25Q32FWSSIF
W25Q32FWSTIG
W25Q32FWSFIG
W25Q32FWZPIG
W25Q32FWZPIQ
W25Q32FWZPIF
W25Q32FWXGIG
TOP SIDE MARKING
25Q32FWSIG
25Q32FWSIQ
25Q32FWSIF
25Q32FWTIG
25Q32FWFIG
25Q32FWIG
25Q32FWIQ
25Q32FWIF
Q32FWXGIG
W25Q32FWZEIG
25Q32FWIG
W25Q32FWTBIG
25Q32FWBIG
W25Q32FWTCIG
W25Q32FWBYIG
W25Q32FWBYIC
25Q32FWCIG
5AF
•xx
5AF
•xx
Notes:
1. For WSON packages, the package type ZP and ZE is not used in the top side marking.
2. WLCSP package type BY has special top marking due to size limitation.
5 = 32Mb; A = W25Q series, 1.8V; xx = date code (year, work week).
- 92 -
Publication Release Date: July 01, 2016
- Revision H