W25Q32FWZPIG-TR Datasheet, PDF (84/94 Pages) Winbond – 1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

10.3 8-Pad WSON 6x5-mm (Package Code ZP)
W25Q32FW
Symbol
A
A1
b
C
D
D2
E
E2
e
L
y
Min
0.70
0.00
0.35
---
5.90
3.35
4.90
4.25
0.55
0.00
Millimeters
Nom
Max
0.75
0.80
0.02
0.05
0.40
0.48
0.20 REF
---
6.00
6.10
3.40
3.45
5.00
5.10
4.30
4.35
1.27 BSC
0.60
0.65
---
0.075
Min
0.028
0.000
0.014
---
0.232
0.132
0.193
0.167
0.022
0.000
Inches
Nom
0.030
0.001
0.016
0.008 REF
0.236
0.134
0.197
0.169
0.050 BSC
0.024
---
Max
0.031
0.002
0.019
---
0.240
0.136
0.201
0.171
0.026
0.003
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
exposed PCB vias under the pad
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