W25Q32FWZPIG-TR Datasheet, PDF (92/94 Pages) Winbond – 1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

10.11 Ordering Information
W25Q32FW
W = Winbond
W⁽¹⁾ 25Q 32F W xx⁽²⁾ I⁽¹⁾
25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
32F = 32M-bit
W = 1.65V to 1.95V
SS = 8-pin SOIC 208-mil
ST = 8-pin VSOP 208-mil
SF = 16-pin SOIC 300-mil
XG = XSON 4x4x0.45-mm
TB = TFBGA 8x6-mm (5x5-1 ball array)
ZP = WSON8 6x5-mm ZE = WSON8 8x6-mm)
BY = 12-ball WLCSP
TC = TFBGA 8x6-mm (6x4 ball array
I = Industrial (-40°C to +85°C)
G=
Q=
F=
C=
(3,4)
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
Green Package with QE=1 in Status Register-2 & SFDP
Green Package with QE=0 in Status Register-2 & SFDP
WLCSP/WLBGA package with backside coating
Notes:
1. The “W” prefix is included on the part marking.
2. Only the 2^nd letter is used for the part marking; WSON package type ZP and ZE are not used for the part marking.
3. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and
Reel (shape T) or Tray (shape S), when placing orders.
4. For shipments with OTP feature enabled, please contact Winbond.
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