W25Q32FWZPIG-TR Datasheet, PDF (8/94 Pages) Winbond – 1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

W25Q32FW
3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array)
Top View
Top View
A2
A3
A4
A5
NC
NC
/RESET
NC
B1
B2
B3
B4
B5
NC
CLK
GND
VCC
NC
C1
C2
C3
C4
C5
NC
/CS
NC /WP (IO2) NC
D1
D2
D3
D4
D5
NC
DO(IO1) DI(IO0) /HOLD(IO3) NC
E1
E2
E3
E4
E5
NC
NC
NC
NC
NC
A1
A2
A3
A4
NC
NC
NC /RESET
B1
B2
B3
B4
NC
CLK
GND
VCC
C1
C2
C3
C4
NC
/CS
NC /WP (IO2)
D1
D2
D3
D4
NC
DO(IO1) DI(IO0) /HOLD(IO3)
E1
E2
E3
E4
NC
NC
NC
NC
F1
F2
F3
F4
NC
NC
NC
NC
Package Code TB
Package Code TC
Figure 1d. W25Q32FW Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code TB, TC)
3.7 Ball Description TFBGA 8x6-mm
BALL NO.
PIN NAME
I/O
FUNCTION
A4
/RESET
I
Reset Input
B2
CLK
I
Serial Clock Input
B3
GND
Ground
B4
VCC
Power Supply
C2
/CS
I
Chip Select Input
C4
/WP (IO2)
I/O
Write Protect Input (Data Input Output 2)⁽²⁾
D2
DO (IO1)
I/O
Data Output (Data Input Output 1)⁽¹⁾
D3
DI (IO0)
I/O
Data Input (Data Input Output 0)⁽¹⁾
D4
/HOLD (IO3)
I/O
Hold Input (Data Input Output 3)⁽²⁾
Multiple
NC
No Connect
Notes:
1. IO0 and IO1 are used for Standard and Dual SPI instructions
2. IO0 – IO3 are used for Quad SPI instructions, /WP & /HOLD (or /RESET) functions are only available for Standard/Dual SPI.
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