W25Q32FWZPIG-TR Datasheet, PDF (91/94 Pages) Winbond – 1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

10.10 12-Ball WLCSP (Package Code BYIG)
W25Q32FW
Symbol
A
A1
c
D
E
D1
E1
eD
eE
b
aaa
bbb
ccc
ddd
Min
0.432
0.152
0.280
2.270
1.990
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0.24
Millimeters
Nom
0.472
0.167
0.305
2.310
2.030
0.405
0.515
0.500
0.500
0.300
0.100
0.100
0.030
0.150
Max
0.512
0.182
0.330
2.350
2.070
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---
---
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0.36
Min
0.017
0.006
0.011
0.089
0.078
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---
---
---
0.009
Inches
Nom
0.019
0.007
0.012
0.091
0.080
0.016
0.020
0.020
0.020
0.012
0.004
0.004
0.001
0.006
Max
0.020
0.007
0.013
0.093
0.082
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---
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0.014
Note:
Dimension b is measured at the maximum solder bump diameter, parallel to primary datum C.
- 90 -
Publication Release Date: July 01, 2016
- Revision H