W25Q32FWZPIG-TR Datasheet, PDF (90/94 Pages) Winbond – 1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

10.9 12-Ball WLCSP (Package Code BYIC)
W25Q32FW
Symbol
A
A1
c
D
E
D1
E1
eD
eE
b
aaa
bbb
ccc
ddd
Min
0.454
0.152
0.302
2.270
1.990
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---
---
---
0.24
Millimeters
Nom
0.497
0.167
0.330
2.310
2.030
0.405
0.515
0.500
0.500
0.300
0.100
0.100
0.030
0.150
Max
0.540
0.182
0.358
2.350
2.070
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---
---
---
0.36
Min
0.018
0.006
0.012
0.089
0.078
---
---
---
---
0.009
Inches
Nom
0.020
0.007
0.013
0.091
0.080
0.016
0.020
0.020
0.020
0.012
0.004
0.004
0.001
0.006
Max
0.021
0.007
0.014
0.093
0.082
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---
---
---
0.014
Note:
Dimension b is measured at the maximum solder bump diameter, parallel to primary datum C.
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