ISD5100 Datasheet, PDF (78/88 Pages) Winbond – SINGLE-CHIP 1 TO 16 MINUTES DURATION VOICE RECORD/PLAYBACK DEVICES WITH DIGITAL STORAGE CAPABILITY

ISD5100 – SERIES
12.4 ISD5116 DIE INFORMATION
V_SSD
SDA SCL ^V_CCD
INT
V_SSD
A0
A1
V_CCD XCLK
RAC
V_SSA
ISD5116 Device
Die Dimensions
X: 4125 µm
Y: 8030 µm
Die Thickness ^[3]
292.1 µm ± 12.7 µm
Pad Opening
Single pad: 90 x 90 µm
Double pad: 180 x 90 µm
≈
ISD5116
≈
V_SSA
MIC +
MIC - ANA OUT -
SP -
ANA OUT +
ACAP
V_SSA ^[2]
V_CCA ^[2]
SP +
ANA IN
AUX OUT
AUX IN
Notes
1.
The backside of die is internally connected to Vss. It MUST NOT be connected to any other potential or
damage may occur.
2.
Double bond recommended, if treated as single doubled-pad.
3.
This figure reflects the current die thickness. Please contact Winbond as this thickness may change in
the future.
- 78 -