ISD5100 Datasheet, PDF (54/88 Pages) Winbond – SINGLE-CHIP 1 TO 16 MINUTES DURATION VOICE RECORD/PLAYBACK DEVICES WITH DIGITAL STORAGE CAPABILITY

ISD5100 – SERIES
7.6.3. Power and Ground Pins
V_CCA, V_CCD (Voltage Inputs)
To minimize noise, the analog and digital circuits in the ISD5100 Series devices use separate power
busses. These +3 V busses lead to separate pins. Tie the V_CCD pins together as close as possible and
decouple both supplies as near to the package as possible.
V_SSA, V_SSD (Ground Inputs)
The ISD5100 Series utilizes separate analog and digital ground busses. The analog ground (V_SSA)
pins should be tied together as close to the package as possible and connected through a low-
impedance path to power supply ground. The digital ground (V_SSD) pin should be connected through a
separate low impedance path to power supply ground. These ground paths should be large enough to
ensure that the impedance between the V_SSA pins and the V_SSD pin is less than 3Ω. The backside of
the die is connected to V_SSD through the substrate resistance. In a chip-on-board design, the die
attach area must be connected to V_SSD.
NC (Not Connect)
These pins should not be connected to the board at any time. Connection of these pins to any signal,
ground or V_CC, may result in incorrect device behavior or cause damage to the device.
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