ISD5100 Datasheet, PDF (55/88 Pages) Winbond – SINGLE-CHIP 1 TO 16 MINUTES DURATION VOICE RECORD/PLAYBACK DEVICES WITH DIGITAL STORAGE CAPABILITY

ISD5100 – SERIES
7.6.4. PCB Layout Examples
For SOIC package :
PC board traces and the three chip capacitors are on the bottom side of the board.
V
Note 1
Note 2
1_O
C1 O
V
O
C2 ^O
O
O XCLK
C
C
D
O
O
Note 3
S
S
D
(Digital Ground)
O
O
O
O ^VSSA
O
O
O
O ^{C1=C2=C3=0.1 uF chip Capacitors}
Note 1: V_SSD traces should be kept
O
O
separated back to the V_SS supply feed ^O
O
point..
O
O
Note 2: V_CCD traces should be kept
O
separate back to the V_CC Supply feed ^O
point.
O
C3 _O
O
O
To
V_CCA
Note 3: The Digital and Analog grounds
tie together at the power supply. The
V_CCA and V_CCD supplies will also need
filter capacitors per good engineering
Analog Ground Note 3
practice (typ. 50 to 100 uF).
For TSOP package :
V_CCD
Note ^[2]
1
V_SSA
V_CCD
V_CCD
V_CCA
V_SSA
V_CCA
Note ^[1]
V_SSD
V_SSD
V_SSD
Note ^[3]
V_SSA
V_SSA
Notes:
[1] _{VSSD traces should be kept separated back to the VSS supply feedpoint.}
[2] _{VCCD traces should be kept separate back to the VCC supply feedpoint.}
[3] _{Digital and Analog grounds tie together at power supply. The VCCA and VCCD supplies will also need filter}
capacitors per good engineering practice (typ. 50 to 100 uF).
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Publication Release Date: October, 2003
Revision 0.2