W987D6HBGX6E-TR Datasheet, PDF (66/68 Pages) Winbond – 128Mb Mobile LPSDR

W987D6HB / W987D2HB
12.ORDERING INFORMATION
128Mb Mobile LPSDR
Mobile LPDDR/LPSDR SDRAM Package Part Numbering
W 98 7 D 6 H B G X 6 I
Product Line
98:mobile LPSDR SDRAM
94:mobile LPDDR SDRAM
Density
7:2⁷=128M 8:2⁸=256M
9:2⁹=512M
Power Supply
D:1.8/1.8 V_DD / V_DDQ
I/O Ports width
6:16bit
2:32bit
Generation
Design revision.
Package or KGD
K: KGD
B: BGA
Temperature
with standard Idd6
G:-25C~85C
with low power Idd6
E:-25C~85C
I:-40C~85C
Clock rate
5:5ns200MHz
6:6ns166MHz
7:7.5ns133MHz
Package Material
X: Lead-free + Halogen-free
Package configuration code
G: 54VFBGA, 8mmx9mm
H: 60VFBGA, 8mmx9mm
J: 90VFBGA, 8mmx13mm
Part number
W987D6HBGX6I
W987D6HBGX6E
W987D6HBGX7I
W987D6HBGX7E
W987D6HBGX7G
W987D2HBGX6I
W987D2HBGX6E
W987D2HBGX7I
W987D2HBGX7E
W987D2HBGX7G
VDD/VDDQ
1.8V/1.8V
1.8V/1.8V
1.8V/1.8V
1.8V/1.8V
1.8V/1.8V
1.8V/1.8V
1.8V/1.8V
1.8V/1.8V
1.8V/1.8V
1.8V/1.8V
I/O width Package
Others
16 54VFBGA 166MHz, -40~85C, Low Power
16 54VFBGA 166MHz, -25~85C, Low Power
16 54VFBGA 133MHz, -40~85C, Low Power
16 54VFBGA 133MHz, -25~85C, Low Power
16 54VFBGA 133MHz, -25~85C
32 90VFBGA 166MHz, -40~85C, Low Power
32 90VFBGA 166MHz, -25~85C, Low Power
32 90VFBGA 133MHz, -40~85C, Low Power
32 90VFBGA 133MHz, -25~85C, Low Power
32 90VFBGA 133MHz, -25~85C
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Publication Release Date: Jun. 09, 2011
Revision A01-002