W987D6HBGX6E-TR Datasheet, PDF (64/68 Pages) Winbond – 128Mb Mobile LPSDR

W987D6HB / W987D2HB
11. PACKAGE DIMENSION
11.1 : LPSDR X 16
VBGA 54Ball (8X9 MM^2, Ball pitch:0.8mm)
128Mb Mobile LPSDR
Note:
1. Ball land:0.5mm. Ball opening:0.4mm. PCB Ball land suggested ≦0.4mm
2. Dimensions apply to Solder Balls Post-Reflow.The Pre-Reflow diameter is 0.42 on a 0.4 SMD Ball Pad
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Publication Release Date: Jun. 09, 2011
Revision A01-002