W988D6FB_13 Datasheet, PDF (64/66 Pages) Winbond – 256Mb Mobile LPSDR

12.2 : LPSDR X 32
W988D6FB / W988D2FB
256Mb Mobile LPSDR
VFBGA90Ball (8X13 MM^2, Ball pitch:0.8mm)
Note:
1. Ball land:0.5mm. Ball opening:0.4mm. PCB Ball land suggested ≦0.4mm
2. Dimensions apply to Solder Balls Post-Reflow. The Pre-Reflow diameter is 0.42 on a 0.4 SMD Ball Pad.
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Publication Release Date : August 15, 2013
Revision A01-004