W988D6FB_13 Datasheet, PDF (2/66 Pages) Winbond – 256Mb Mobile LPSDR

W988D6FB / W988D2FB
3. ORDERING INFORMATION
256Mb Mobile LPSDR
Mobile LPDDR/LPSDR SDRAM Package Part Numbering
W 98 8 D 6 F B G X 6 I
Product Line
98:mobile LPSDR SDRAM
94:mobile LPDDR SDRAM
Density
7:2⁷=128M 8:2⁸=256M
9:2⁹=512M
Power Supply
D:1.8/1.8 V_DD / V_DDQ
I/O Ports width
6:16bit
2:32bit
Generation
Design revision.
Package or KGD
K: KGD
B: BGA
Temperature
with standard Idd6
G:-25C~85C
with low power Idd6
E:- 25C~85C
I:- 40C~85C
Clock rate
5:5ns200MHz
6:6ns166MHz
7:7.5ns133MHz
Package Material
X: Lead-free + Halogen-free
Package configuration code
G: 54VFBGA, 8mmx9mm
H: 60VFBGA, 8mmx9mm
J: 90VFBGA, 8mmx13mm
Part number V_DD/V_DDQ I/O width Package
Others
W988D6FBGX6I 1.8V/1.8V 16 54VFBGA 166MHz, -40C~85C, Low Power
W988D6FBGX6E 1.8V/1.8V 16 54VFBGA 166MHz, -25C~85C, Low Power
W988D6FBGX7E 1.8V/1.8V 16 54VFBGA 133MHz, -25C~85C, Low Power
W988D6FBGX7G 1.8V/1.8V 16 54VFBGA 133MHz, -25C~85C
W988D6FBGX7I 1.8V/1.8V 16 54VFBGA 133MHz, -40C~85C, Low Power
W988D2FBJX6I 1.8V/1.8V 32 90VFBGA 166MHz, -40C~85C, Low Power
W988D2FBJX6E 1.8V/1.8V 32 90VFBGA 166MHz, -25C~85C, Low Power
W988D2FBJX7E 1.8V/1.8V 32 90VFBGA 133MHz, -25C~85C, Low Power
W988D2FBJX7G 1.8V/1.8V 32 90VFBGA 133MHz, -25C~85C
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Publication Release Date : August 15, 2013
Revision A01-004