W988D6FB_13 Datasheet, PDF (63/66 Pages) Winbond – 256Mb Mobile LPSDR

W988D6FB / W988D2FB
12. PACKAGE DIMENSION
12.1 : LPSDR X 16
VFBGA54Ball (8X9 MM^2, Ball pitch:0.8mm)
256Mb Mobile LPSDR
Note:
1. Ball land:0.5mm. Ball opening:0.4mm. PCB Ball land suggested ≦0.4mm
2. Dimensions apply to Solder Balls Post-Reflow.The Pre-Reflow diameter is 0.42 on a 0.4 SMD Ball Pad
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Publication Release Date : August 15, 2013
Revision A01-004