W25Q32JVSFIQ-TR Datasheet, PDF (4/78 Pages) Winbond – 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI

W25Q32JV
Global Block/Sector Lock (7Eh) ..........................................................................................60
Global Block/Sector Unlock (98h) .......................................................................................60
Enable Reset (66h) and Reset Device (99h) ......................................................................61
9. ELECTRICAL CHARACTERISTICS........................................................................................... 62
9.1 Absolute Maximum Ratings ⁽¹⁾ ...................................................................................... 62
9.2 Operating Ranges.......................................................................................................... 62
9.3 Power-Up Power-Down Timing and Requirements ......................................................... 63
9.4 DC Electrical Characteristics-......................................................................................... 64
9.5 AC Measurement Conditions.......................................................................................... 65
9.6 AC Electrical Characteristics⁽⁶⁾ ....................................................................................... 66
9.7 Serial Output Timing ...................................................................................................... 68
9.8 Serial Input Timing ......................................................................................................... 68
9.9 /HOLD Timing ................................................................................................................ 68
9.10 WP Timing ..................................................................................................................... 68
10. PACKAGE SPECIFICATIONS ................................................................................................... 69
10.1 8-Pin SOIC 208-mil (Package Code SS) ........................................................................ 69
10.2 8-Pin VSOP 208-mil (Package Code ST) ....................................................................... 70
10.3 8-Pad WSON 6x5-mm (Package Code ZP) .................................................................... 71
10.5 16-Pin SOIC 300-mil (Package Code SF)....................................................................... 72
10.6 8-Pin PDIP 300-mil (Package Code DA)......................................................................... 73
10.8 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array)........................................... 74
11. ORDERING INFORMATION...................................................................................................... 75
11.1 Valid Part Numbers and Top Side Marking ..................................................................... 76
12. REVISION HISTORY................................................................................................................. 77
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