W25B40 Datasheet, PDF (35/36 Pages) Winbond – 4M-BIT SERIAL FLASH MEMORY WITH BOOT AND PARAMETER SECTORS

W25B40/W25B40A
12. REVISION HISTORY
VERSION
A
DATE
06/09/04
B
08/13/04
C
09/25/04
D
11/03/04
E
12/05/04
F
01/19/05
G
04/03/05
H
05/09/05
I
06/14/05
J
06/28/05
K
12/22/05
L
12/26/05
M
01/06/06
PAGE
ALL
5
DESCRIPTION
New Create
Updated fR and tCRLH, tCRLL data in AC Electrical
Characteristics
Updated tSE data in AC Electrical Characteristics
Modified tLEAD in Absolute Maximum Ratings to
reference JEDEC Standard information. Added FR
and fR conditions to Operating Ranges. Updated ICC3
and ICC5 data in DC Electrical Characteristics. Added
20/33MHz call outs and updated min, max and typ
data in AC Electrical Characteristics. Updated text for
Chip Erase instruction.
Updated 8-pin SOIC 150-mil package information.
Updated Green Package information under Special
Options of Ordering Information. Removed 8-contact
MLP 6x5mm package
Updated Sector Erase instruction and related notes in
Instruction Set.
Updated package dimension symbols and values A1
and y for compliance.
Updated and improved AC Parameters in and
changed tCHSH, tCLQV and tHLCH to reference voltage
(2.7V-3.6V / 3.0V-3.6V) for consistency with other
spiFlash memory data sheets.
Updated Important Notice
Changed NexFlash part numbers to Winbond part
numbers and updated ordering and contact
information
Updated data sheet to comply with Winbond
standard. Updated FR and fR values in Operating
Ranges Table and AC Characteristics Table
Updated fR = 25MHz and 33MHz in Operating
Ranges Table and AC Characteristics Table for both
2.7V-3.6V and 3.0V-3.6V.
Corrected Ordering Information chart from product
family 25P to 25B.
Corrected Ordering Information
Corrected the pin assignment on table of pin
description of page 5.
- 35 -
Publication Release Date: January 6, 2006
Revision M