W25B40 Datasheet, PDF (33/36 Pages) Winbond – 4M-BIT SERIAL FLASH MEMORY WITH BOOT AND PARAMETER SECTORS

10. PACKAGE SPECIFICATION
10.1 8-Pin SOIC 150-mil (Package Code SN)
W25B40/W25B40A
SYMBOL
A
A1
A2
b
C
D⁽³⁾
E
E1⁽³⁾
e⁽²⁾
L
θ
y
MILLIMETERS
MIN
TYP.
MAX
1.47
1.60
1.72
0.10
---
0.24
---
1.45
---
0.33
0.41
0.50
0.19
0.20
0.25
4.80
4.85
4.95
5.80
6.00
6.19
3.80
3.90
4.00
1.27 BSC
0.40
0.71
1.27
0^o
---
8^o
---
---
0.076
INCHES
MIN
0.058
0.004
---
0.013
0.0075
0.189
0.228
0.150
0.015
0^o
---
TYP.
0.063
---
0.057
0.016
0.008
0.191
0.236
0.154
0.050 BSC
0.028
---
---
MAX
0.068
0.010
---
0.020
0.0098
0.195
0.244
0.157
0.050
8^o
0.003
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
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Publication Release Date: January 6, 2006
Revision M