W741E20X Datasheet, PDF (31/84 Pages) Winbond – 4-BIT FLASH MICROCONTROLLER

Preliminary W741E20X
PAD ASSIGNMENT & POSITIONS
2790 µ m
4000 µm
321
4
5
6
7
8
9
10
11
12 13 14
29 28 27
26
25
Y
X
(0,0)
24
23
22
21
20
19
15 16 17 18
Note: The chip substrate must be connected to system ground (VSS).
PAD NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
PAD NAME
RA2
RA3
INT
RES
VSS
RE0
RE1
RE2
RE3
VSS
RB0
RB1
RB2
RB3
MFP
X
-207.80
-482.00
-804.20
-1160.80
-1160.80
-1158.80
-1158.80
-1158.80
-1158.80
-1160.80
-1158.80
-903.10
-636.10
-361.90
-3.20
Y
1744.11
1744.11
1746.11
828.61
441.01
155.31
-115.69
-752.09
-1023.09
-1242.29
-1522.29
-1763.79
-1763.79
-1763.79
-1763.79
PAD NO.
16
17
18
19
20
21
22
23
24
25
26
27
28
29
PAD NAME
RC0
RC1
RC2
RC3
VDD
RD0
RD1
RD2
RD3
VDD
XOUT
XIN
RA0
RA1
X
275.20
600.00
878.40
1152.90
1152.90
1152.90
1152.90
1152.90
1152.90
1152.90
1152.90
825.80
505.00
230.80
Y
-1763.79
-1763.79
-1763.79
-1563.29
-1329.49
-1083.29
-812.29
-533.89
262.89
1298.81
1524.11
1742.71
1744.11
1744.11
- 31 -
Publication Release Date: March 1998
Revision A1