W83194R-37 Datasheet, PDF (12/19 Pages) Winbond – 100 MHZ AGP CLOCK FOR VIA CHIPSET

Preliminary W83194R-37/-58
9.3 DC Characteristics
VDDq2 = VDD = VDDq3 = 3.3V ±5%, VDDq2b = 2.375V~2.9V, TA = 0 °C to +70 °C
PARAMETER
SYM. MIN. TYP. MAX. UNITS TEST CONDITIONS
Input Low Voltage
VIL
0.8
V_dc
Input High Voltage
VIH
2.0
V_dc
Input Low Current
IIL
-66
µA
Input High Current
IIH
5
µA
Output Low Voltage
VOL
IOL = 4 mA
0.4
V_dc ^{All outputs}
Output High Voltage
IOH = 4 mA
VOH 2.4
V_dc ^{All outputs using 3.3V}
power
Tri-State leakage Current IOZ
10
µA
Dynamic Supply Current IDD3
for VDD + VDDq3
mA CPU = 66.6 MHz
PCI = 33.3 MHz with load
Dynamic Supply Current IDD2
for VDDq2 + VDDq2b
mA Same as above
CPU Stop Current for
VDD + VDDq3
ICPUS3
mA Same as above
CPU Stop Current for
VDDq2 + VDDq2b
ICPUS2
mA Same as above
PCI Stop Current for VDD IPD3
mA
+ VDDq3
9.4 Buffer Characteristics
9.4.1 Type 1 Buffer for CPU (0:3)
PARAMETER
Pull-up Current Min.
Pull-up Current Max.
Pull-down Current Min.
Pull-down Current Max.
Rise/Fall Time Min.
Between 0.4V and 2.0V
Rise/Fall Time Max.
Between 0.4V and 2.0V
SYMBOL
IOH (min.)
IOH (max.)
IOL (min.)
IOL (max.)
TRF (min.)
TRF (max.)
MIN.
-27
0.4
TYP.
MAX.
-27
27
1.6
UNITS
mA
mA
mA
mA
nS
TEST CONDITIONS
Vout = 1.0V
Vout = 2.0V
Vout = 1.2V
Vout = 0.3V
10 pF Load
nS 20 pF Load
- 12 -