SI5509DC_08 Datasheet, PDF (1/12 Pages) Vishay Siliconix – N- and P-Channel 20-V (D-S) MOSFET

New Product
Si5509DC
Vishay Siliconix
N- and P-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
N-Channel
P-Channel
V_DS (V)
20
–20
r_DS(on) (W)
0.052 at V_GS = 4.5 V
0.084 at V_GS = 2.5 V
0.090 at V_GS = –4.5 V
0.160 at V_GS = –2.5 V
I_D (A)
6.1^a
4.8^a
–4.8^a
–3.6^a
Q_g (Typ)
3.9 nc
3.8 nc
1206-8 ChipFETr
FEATURES
D TrenchFETr Power MOSFETs
APPLICATIONS
D Complementary MOSFET for Portable
Devices
– Ideal for Buck–Boost Circuits
RoHS
COMPLIANT
1
S₁
D₁
D₁
G₁
S₂
D₂
G₂
D₂
Bottom View
Marking Code
ED XXX
Lot Traceability
and Date Code
Part # Code
Ordering Information: Si5509DC-T1–E3 (Lead (Pb)–Free)
D₁
G₁
S₁
N-Channel MOSFET
S₂
G₂
D₂
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 _C UNLESS OTHERWISE NOTED)
Parameter
Symbol
N-Channel
P-Channel
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T_J = 150 _C)
Pulsed Drain Current
Source-Drain Current Diode Current
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_C = 25 _C
T_C = 70 _C
T_A = 25 _C
T_A = 70 _C
T_C = 25 _C
T_A = 25 _C
T_C= 25 _C
T_C= 70 _C
T_A = 25 _C
T_A = 70 _C
V_DS
V_GS
I_D
I_DM
I_S
P_D
T_J, T_stg
20
6.1^a
4.9^a
5.0^{b, c}
3.9^{b, c}
10
3.7
1.7^{b, c}
4.5
2.88
2.1^{b, c}
1.33^{b, c}
"12
–55 to 150
260
–20
–4.8^a
–3.8^a
–3.9^{b, c}
–3.1^{b, c}
–15
–3.7
–1.7^{b, c}
4.5
2.88
2.1^{b, c}
1.33^{b, c}
Unit
V
A
W
_C
THERMAL RESISTANCE RATINGS
N-Channel
P-Channel
Parameter
Symbol
Typ
Max
Typ
Max
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Foot (Drain)
t v 5 sec
Steady-State
R_thJA
R_thJF
50
60
50
60
_C/W
30
40
30
40
Notes
a. Based on T_C = 25 _C.
b. Surface Mounted on 1” x 1” FR4 Board.
c. t = 5 sec
d. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation
process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder
interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 90 _C/W for both channels.
Document Number: 73629
S–60417—Rev. A, 20-Mar-06
www.vishay.com
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