TMPR4956C Datasheet, PDF (38/286 Pages) Toshiba Semiconductor – 64-Bit TX System RISC TX49 Family

Handling Precautions
(3) When washing devices, do not rub markings with a brush or with your hand while the cleansing liquid is
still on the device. Doing so can rub off the markings.
(4) Dip cleaning, shower cleaning and steam cleaning processes are performed based on the chemical action of
a solvent. When immersing devices in a solvent or steam bath, complete the cleaning for a period of one
minute or less at a liquid temperature of 50°C or less, taking into consideration the effects on the devices.
(5) Avoid use of ultrasonic cleaning with hermetically sealed ceramic packages such as a leadless chip carrier
(LCC), pin grid array (PGA) or charge-coupled device (CCD). Using the ultrasonic cleaning may cause the
internal wires to become disconnected due to resonance. Even if a device package allows ultrasonic
cleaning, keep the duration of ultrasonic cleaning in a brief time. Long hours of ultrasonic cleaning may
deteriorate the adhesion between the mold resin and frame material.
The basic recommended conditions are as follows:
Recommended Ultrasonic Cleaning Conditions
Frequency: 27 to 29kHz
Ultrasonic output: 15W/L or less
Cleaning time: 30 seconds or less
Suspend the printed circuit board in the solvent bath to ensure that the circuit board and device do not come in
direct contact with the ultrasonic vibrator.
3.5.5 No Cleaning
It is recommended that you clean analog devices and high-speed devices. If such devices are not cleaned, flux
may cause minute leakage between leads or migration, depending on the flux grade. Be sure therefore to check
cleanliness at the time of use. If you are considering no cleaning, be sure to use a flux that does not require
cleaning.
3.5.6 Tape Carrier Packages (TCPs) Mounting
(1) When tape carrier packages are mounted, measures must be taken to prevent electrostatic breakdown of the
devices.
(2) When separating devices from tape, or carrying out outer lead bonding (OLB) mounting, be sure to take
work safety into consideration.
(3) The base film, which is made of polyimide, is hard and thin. Be careful not to injury yourself or damage
any objects during handling.
(4) When punching tape, take countermeasures to prevent minute broken pieces from scattering. Scattered
pieces may cause injury.
(5) Appropriately treat the tape, reels and spacers left after separating the device as industrial waste.
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