CC3220MOD Datasheet, PDF (71/82 Pages) Texas Instruments – SimpleLink Wi-Fi CERTIFIED Wireless Module Solution

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CC3220MOD
SWRS206 – MARCH 2017
8 Environmental Requirements and Specifications
8.1 Temperature
8.1.1 PCB Bending
The PCB bending specification will maintain planeness at a thickness of less than 0.1 mm.
8.2 Handling Environment
8.2.1 Terminals
The product is mounted with motherboard through land-grid array (LGA). To prevent poor soldering, do
not make skin contact with the LGA portion.
8.2.2 Falling
The mounted components will be damaged if the product falls or is dropped. Such damage may cause the
product to malfunction.
8.3 Storage Condition
8.3.1 Moisture Barrier Bag Before Opened
A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH.
The calculated shelf life for the dry-packed product will be 12 months from the date the bag is sealed.
8.3.2 Moisture Barrier Bag Open
Humidity indicator cards must be blue, < 30%.
8.4 Baking Conditions
Products require baking before mounting if:
• Humidity indicator cards read > 30%
• Temp < 30°C, humidity < 70% RH, over 96 hours
Baking condition: 90°C, 12 to 24 hours
Baking times: 1 time
8.5 Soldering and Reflow Condition
• Heating method: Conventional convection or IR convection
• Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering
portion or equivalent method
• Solder paste composition: Sn/3.0 Ag/0.5 Cu
• Allowable reflow soldering times: 2 times based on the reflow soldering profile
(see Figure 8-1)
• Temperature profile: Reflow soldering will be done according to the temperature profile (see
Figure 8-1)
• Peak temperature: 245°C
Copyright © 2017, Texas Instruments Incorporated
Environmental Requirements and Specifications
71
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