LP3910 Datasheet, PDF (7/72 Pages) Texas Instruments – Power Management IC for Hard-Drive-Based Portable Media Players

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LP3910
SNVS481M – NOVEMBER 2006 – REVISED DECEMBER 2015
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)^(1)(2)(3)
Supply voltage CHG_DET
Battery voltage VBATT1, 2, 3
Voltage
USBPWR, VIN1,VIN2,VIN3,VIN4, VDD1,VDD2,VDD3
All other pins
Power dissipation (T_A = 70°C)⁽⁴⁾
Storage temperature, T_stg
MIN
MAX
UNIT
–0.3
6.5
V
–0.3
5
V
–0.3
6.2
V
–0.3
V_DD + 0.3
V
2.6
W
–45
150
ºC
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) In applications where high power dissipation or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP =
125°C), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to-ambient thermal resistance of the
part/package in the application (R_θJA), as given by the following equation: T_A-MAX = T_J-MAX-OP − (R_θJA × P_D-MAX).
(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J = 160°C (typical) and
disengages at T_J = 140°C (typical).
7.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Machine model
VALUE
±2000
±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)^(1)(2)(3)
CHG_DET
USBPWR
VBATT1, 2, 3
VIN1, VIN2, VIN3, VIN4, VDD1, VDD2, VDD3
VDDIO
Junction temperature, T_J
Ambient temperature, T_A
Power dissipation, T_J-MAX and T_A-MAX
MIN
NOM
MAX UNIT
4.5
6
V
4.35
6
V
0
4.5
V
2.5
6
V
2.5
V_DD
V
–40
125
°C
–40
85
°C
1.6
W
(1) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
(2) Minimum and maximum limits are specified by design, test, or statistical analysis. Nominal numbers are not ensured, but do represent
the most likely norm.
(3) Nominal values and limits are for T_J = 25°C.
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
LP3910
NJV (WQFN)
UNIT
48 PINS
R_θJA
Junction-to-ambient thermal resistance
25
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
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