BQ24618_15 Datasheet, PDF (7/43 Pages) Texas Instruments – System Power Selector and Low

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bq24618
SLUSA55B – OCTOBER 2010 – REVISED APRIL 2015
7.3 Recommended Operating Conditions
VCC, ACP, ACN, SRP, SRN, BATDRV, ACDRV, CE, STAT1, STAT2, PG
PH
VFB
Voltage
REGN, LODRV, ACSET, TS, TTC
BTST, HIDRV with respect to GND
ISET1, ISET2
VREF
Maximum difference ACP–ACN, SRP–SRN
voltage
T_J Junction temperature
MIN
NOM MAX UNIT
–0.3
28
–2
30
–0.3
14
–0.3
6.5 V
–0.3
34
–0.3
3.3
3.3
–0.2
0.2 V
0
125 °C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
bq24616
RGE [VQFN]
UNIT
24 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
43
°C/W
54.3
°C/W
20
°C/W
0.6
°C/W
19
°C/W
4
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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