DRV8305_16 Datasheet, PDF (6/59 Pages) Texas Instruments – Three Phase Gate Driver

DRV8305
SLVSCX2B – AUGUST 2015 – REVISED FEBRUARY 2016
www.ti.com
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 ⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101 ⁽²⁾
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_PVDD
V_PVDD
V_PVDDRAMP
V_{PVDD-SH_X}
I_{SRC_VCPH}
C_{O_OPA}
I_nFAULT
F_gate
I_GATE
T_A
Power supply voltage
Power supply voltage for voltage regulator operation
Power supply voltage ramp rate (PVDD = 0 to 20 V rising <3-mA pin sink
current)
Total voltage drop from PVDD to SH_X pins
External load on VCPH pin (current limit resistor in series to load)
Maximum external capacitive load on shunt amplifier (no external resistor on
output, excluding internal pin capacitance)
nFAULT sink current (VnFAULT = 0.3 V)
Operating switching frequency of gate driver
Total average gate driver current (HS + LS) – charge pump limited
Operating ambient temperature
(1) IC is fully functional and tested in the range 4.4 to 45 V.
(2) Subject to thermal dissipation limits.
MIN
MAX UNIT
4.4
45 ⁽¹⁾
V
4.3
45 ⁽²⁾
V
1 V/µs
4.5
V
10 mA
60
pF
7 mA
200 kHz
30 mA
–40
125
°C
6.4 Thermal Information
THERMAL METRIC ⁽¹⁾
DRV8305
PHP (HTQFP)
UNIT
48 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
26.6
°C/W
12.9
°C/W
7.6
°C/W
0.3
°C/W
7.5
°C/W
0.6
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6
Submit Documentation Feedback
Product Folder Links: DRV8305
Copyright © 2015–2016, Texas Instruments Incorporated