LP3913 Datasheet, PDF (5/70 Pages) Texas Instruments – Power Management IC for Flash Memory-Based Portable Media Players

LP3913
www.ti.com
SNVS489I – NOVEMBER 2006 – REVISED SEPTEMBER 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS ^{(1) (2)(3)(4)}
Supply voltage range CHG_DET
Voltage range USBPWR,
VIN1,VIN2,VIN3,VIN4, VDD1,VDD2,VDD3
Battery voltage range VBATT1, 2, 3
All other pins
Storage Temperature Range
Power Dissipation (T_A = 70°C ⁽⁵⁾):
ESD Rating ⁽⁶⁾
Human Body Model:
Machine Model:
−0.3V to +6.5V
−0.3V to +6.2V
−0.3V to +5V
−0.3V to VDD +0.3V
−45ºC to +150ºC
2.6W
2.0 kV
200V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test
conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pin.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP =
125°C), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to-ambient thermal resistance of the
part/package in the application (θ_JA), as given by the following equation: T_A-MAX = T_J-MAX-OP − (θ_JA × P_D-MAX).
(4) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(5) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J = 160°C (typ.) and
disengages at T_J = 140°C (typ.).
(6) The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin. MIL-STD-883 3015.7.
RECOMMENDED OPERATING CONDITIONS^{(1) (2) (3)}
CHG_DET
4.5V to 6.0V
USBPWR
4.35V to 6.0V
VBATT1, 2, 3
0V to 4.5V
VIN1, VIN2, VIN3, VIN4, VDD1, VDD2, VDD3
2.5V to 6.0V
VDDIO
2.5V to VDD
Junction Temperature (T_J) Range
Ambient Temperature (T_A) Range
Power Dissipation for T_JjMAX and T_AMAX
−40°C to +125°C
−40°C to +85°C
1.6W
(1) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
(2) Min and Max limits are specified by design, test, or statistical analysis. Typical numbers represent the most likely norm.
(3) Typical values and limits appearing in normal type for T_J = 25°C. Limits appearing in boldface type apply over the entire junction
temperature range for operation, −40°C to +125°C.
THERMAL INFORMATION⁽¹⁾
Junction-to-Ambient Thermal Resistance (θ_JA),
48-pin WQFN NJV0048A Package ⁽²⁾
25°C/W
(1) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP =
125°C), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to-ambient thermal resistance of the
part/package in the application (θ_JA), as given by the following equation: T_A-MAX = T_J-MAX-OP − (θ_JA × P_D-MAX).
(2) Min and Max limits are specified by design, test, or statistical analysis. Typical numbers represent the most likely norm.
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