LMH2832 Datasheet, PDF (5/46 Pages) Texas Instruments – LMH2832 Fully Differential, Dual, 1.1-GHz, Digital Variable-Gain Amplifier

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LMH2832
SBOS709A – JULY 2016 – REVISED JULY 2016
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
MIN
Power supply
–0.5
Input applied to analog inputs
INPA, INMA, INPB, INMB
–0.5
Voltage applied to input pins
–0.5
Digital input/output voltage range
–0.3
Operating junction temperature, T_J
Storage temperature, T_stg
–40
MAX
5.5
5.5
5.5
2
125
125
UNIT
V
V
V
V
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±2000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
V_S
Power-supply voltage
4.75
Specified operating temperature range
–40
NOM
5
MAX
5.25
85
UNIT
V
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
LMH2832
RHA (VQFN)
UNIT
40 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
29.5
°C/W
20.4
°C/W
6.6
°C/W
0.3
°C/W
6.5
°C/W
2.3
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
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