DS90CR216A Datasheet, PDF (5/34 Pages) Texas Instruments – 3.3-V Rising Edge Data Strobe LVDS Receiver

www.ti.com
6 Specifications
DS90CR216A, DS90CR286A, DS90CR286A-Q1
SNLS043H – MAY 2000 – REVISED JANUARY 2016
6.1 Absolute Maximum Ratings
see ⁽¹⁾⁽²⁾
Supply voltage (V_CC)
LVCMOS output voltage
LVDS receiver input voltage
Junction temperature
Lead temperature (soldering, 4 sec)
Storage temperature, T_stg
MIN
MAX
–0.3
4
–0.3
–0.3
(V_CC + 0.3 V)
(V_CC + 0.3 V)
150
260
–65
150
UNIT
V
V
V
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±7000
±700
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
Supply voltage (V_CC)
Operating free air temperature (T_A)
Receiver input range
Supply noise voltage (V_NOISE)
MIN
NOM
MAX
UNIT
3.0
3.3
3.6
V
–40
25
85
°C
0
2.4
V
100
mV_PP
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
DS90CR286A/-Q1
DGG (TSSOP)
DS90CR216A
DGG (TSSOP)
UNIT
56 PINS
48 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
64.6
67.8
°C/W
20.6
22.1
°C/W
33.3
34.8
°C/W
1.0
1.1
°C/W
33.0
34.5
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Copyright © 2000–2016, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: DS90CR216A DS90CR286A DS90CR286A-Q1