CC2564C Datasheet, PDF (48/52 Pages) Texas Instruments – CC2564C Dual-Mode Bluetooth Controller

CC2564C
SWRS199A – APRIL 2016 – REVISED NOVEMBER 2016
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8.4 Documentation Support
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the
upper right corner, click on Alert me to register and receive a weekly digest of any product information that
has changed. For change details, review the revision history included in any revised document.
The current documentation that describes the DSP, related peripherals, and other technical collateral is as
follows:
Application Reports
CC2564C Bluetooth 4.1 and 4.2 Application Notes
CC256x QFN PCB Guidelines
User's Guides
CC2564B to CC2564C Migration Guide
CC256xC QFN EM User’s Guide
CC256x Reference Design Files
CC2564 Audio Sink Reference Design
CC256x Hardware Design Checklist
8.5 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online Community The TI engineer-ro-engineer (E2E) community was created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
TI Embedded Processors Wiki Established to help developers get started with Embedded Processors
from Texas Instruments and to foster innovation and growth of general knowledge about the
hardware and software surrounding these devices.
8.6 Trademarks
E2E is a trademark of Texas Instruments.
ARM7TDMI is a registered trademark of ARM Limited.
iPod is a registered trademark of Apple, Inc.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
All other trademarks are the property of their respective owners.
8.7 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.8 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
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